Semiconductor Metrology

TXRF-V310

TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF-V310 can measure elements from Na through U with a single-target, 3-beam X-ray system and a liquid nitrogen-free detector system. The TXRF-V310 includes Rigaku’s patented XYθ sample stage system, an in-vacuum wafer robotic transfer system, and new user-friendly […]

TXRF-310

TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF-310 can measure elements from Na through U with a single-target, 3-beam X-ray system and a liquid nitrogen-free detector system. The TXRF-310 includes Rigaku’s patented XYθ sample stage system, an in-vacuum wafer robotic transfer system, and new user-friendly […]

TXRF-V450

TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF-V450 can measure elements from Na through U with a single-target, 3-beam X-ray system and a liquid nitrogen-free detector system. The TXRF-V450 includes Rigaku’s patented XYθ sample stage system, an in-vacuum wafer robotic transfer system, and new user-friendly […]

TXRF 3800e

TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF 3800e can measure elements from S through U with a single-target, dual-beam X-ray system and a new liquid nitrogen-free detector system. The TXRF 3800e includes Rigaku’s patent pending X-Y-θ sample stage system, an in-vacuum wafer robotic transfer […]

TXRF 3760

TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF 3760 can measure elements from Na through U with a single-target, 3-beam X-ray system and a liquid nitrogen-free detector system. The TXRF 3760 includes Rigaku’s patented XYθ sample stage system, an in-vacuum wafer robotic transfer system, and […]

MFM310

The Rigaku MFM310 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to multilayer stacks. Designed for high-volume manufacturing The MFM310 is designed with high-volume 200mm and 300mm manufacturing in mind: high-throughput […]

AZX400

The Wavelength-Dispersive (WD) XRF technique enables elemental analysis (composition and film thickness) with high energy resolution. The Rigaku AZX 400 is a sequential WDXRF spectrometer specifically designed to handle very large and/or heavy samples. Accepting samples up to 400mm diameter, 50mm thick, and 30kg mass, the AZX 400 is ideal for analyzing sputtering targets, magnetic […]

WDA-3650

The WDA-3650 X-ray fluorescence spectrometer for thin film evaluation continues Rigaku’s 30-year history of XRF wafer analyzers that has mirrored the history of thin film device development. This latest XRF metrology tool contributes significantly to the process control of metal film thickness, film composition, and element concentration with new functions and a low-COO design. XRF […]

WaferX 310

Rigaku’s WaferX 310 represents the culmination of 35 years of experience in the X-ray fluorescence analysis of thin films on silicon wafers. Specifically developed as an in-process metrology tool, the system incorporates “bridge tool” technology — servicing 6″, 8″, as well as the latest 12″ wafers. Simultaneous thickness and composition The WaferX 310 is ideal […]